Take one service or the full programme. Every discipline below is done in-house.
Architecture definition, component selection and sourcing checks, schematic capture and formal design review before a single track is routed.
PCB capabilities →
Placement, routing and stack-up for boards from 2 to 16 layers. Controlled impedance, length matching, EMC-aware floorplanning. Altium, Cadence, PADS and Mentor.
Full capabilities →Bare-metal and RTOS firmware, board support packages, peripheral drivers, bootloaders and communication stacks — written by the people who designed the hardware.
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HDL design in Verilog and VHDL, functional simulation, synthesis, timing closure and on-hardware verification.
Learn more →Requirements to production: electronics, firmware, mechanical fit, enclosure integration, pilot build and handover.
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Manufacturability, assembly and test reviews before release. Catching a footprint error on screen costs nothing. Catching it on a panel costs a build.
Impedance-controlled routing, differential pairs, length tuning, return-path management and pre-layout guidance for DDR4/5, PCIe, USB 3.x and SERDES interfaces.
Switch-mode supplies, DC-DC conversion, motor drive and high-current design. Thermal management, isolation and creepage handled to the standard.
Antenna placement and matching, RF layout, shielding and integration of Wi-Fi, BLE, LoRa, NB-IoT and cellular modules.
Boards rebuilt when the original parts no longer exist. Form-fit-function replacements from an old board, a drawing, or nothing at all.
