Schematic to layout. Firmware to bring-up. Prototype to production.
We build what we design. No handoffs, no surprises.
Power stage, controller and firmware — designed from the ground up.
One team. Design, firmware, and build — handled in-house.
Architecture, part selection, schematic capture and formal design review.
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Multilayer, high-speed, HDI and rigid-flex in Altium, Cadence, PADS and Mentor.
Capabilities
Bare-metal and RTOS firmware, BSPs and drivers — by the engineers who designed the board.
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Concept to pilot build to production handover — electronics, firmware, and enclosure.
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Altium, Cadence, PADS and Mentor — all four major EDA environments, in one building. Controlled impedance, BGA escape routing, length matching and stack-up design.
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Fabrication, SMT and through-hole assembly, rework, board bring-up and test. We do not outsource the build and hand you back a box.
Fabrication & assemblyA schematic, a Gerber pack, a spec sheet, or a rough block diagram. We will reply with scope and timeline.
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