All four major EDA environments, in one building. Multilayer, high-speed, HDI and rigid-flex.
PCB layout is the core of what we do. We work natively in all four major EDA environments and handle every step of the flow — library, schematic, placement, routing, stack-up, DFM and fabrication data — in-house.
Migrating between tools, or inheriting a design in a format the previous vendor could not open? That is routine work for us.
Primary environment for schematic capture, layout, 3D visualisation and output generation.
Constraint-driven high-speed layout, complex signal integrity setups and multi-board work.
Legacy database support and rapid mid-complexity turnarounds.
Enterprise design flows, team-based co-design and advanced constraint management.
| Parameter | Capability |
|---|---|
| Layer count | 2 – 16 layers |
| Minimum trace width | 3 mil (0.075 mm) |
| Minimum trace space | 3 mil (0.075 mm) |
| Minimum via drill | 0.2 mm (laser), 0.3 mm (mechanical) |
| Minimum BGA pitch | 0.4 mm |
| Impedance control | Single-ended and differential |
| Board technologies | Rigid, rigid-flex, flex, HDI, microvia, blind & buried via, heavy copper |
| Signal categories | Digital, analog, mixed-signal, RF, power |
| High-speed interfaces | DDR4/5, PCIe Gen 3/4, USB 3.x, GbE / 10GbE, SERDES, CAN, RS-485 |
Specific capability limits vary with the chosen fabricator and stack-up. Contact us with your requirements for a confirmed answer.
Laser-drilled microvias, via-in-pad, blind & buried vias and sequential lamination.
Dog-bone fanout, breakout strategy, via-in-pad and anti-pad optimisation.
IPC-2223 compliant bend zone design, stiffener and coverlay specification.
Serpentine tuning for DDR and other parallel buses. Differential pair coupling throughout.
High-current power planes, thermal via arrays and component derating.
Pre-layout SI guidance, impedance review, return-path management and eye-diagram verification.
Interfaces, constraints, layer count, form factor. Approval on stack-up before schematic starts.
Verified symbols, footprints and 3D models. Nothing placed without a checked footprint.
Hierarchical or flat, ERC clean. Formal review before handoff to layout.
Stack-up, floorplan, placement and constraint-driven routing.
DRC, DFM, 3D mechanical fit check and impedance review.
Complete, reviewed fabrication and assembly data. Nothing leaves without a sign-off.
We will confirm layer count, technology requirements and timeline within one working day.
Contact us